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Brandauer are committed to developing and championing the most innovative precision stamped components and supplying them across multiple industry sectors. Electronics is one industry in particular which consistently demands such innovation. Brandauer answered some of those demands by recently becoming the only UK supplier of EloPin® press-fit.
This new and exciting capability is the foremost reason for our presence at WNIE (What’s New In Electronics) Live between 25th and 26th September. Brandauer believe that WNIE Live offers the perfect opportunity to showcase the benefits of a press-fit pin that enables a truly reliable solderless connection to a PCB.
WNIE Live will be co-located with a host of other industry events including EMC UK, Embedded Live, Sensors & Instrumentation, PPMA and the TCT Show at the NEC in Birmingham. With such a close association to that many Electronics industry events, you can be confident that the latest technologies will be on display and in action at WNIE Live.
Delivering an exhibition that’s stronger than ever before, WNIE has a mix of conferences, seminars, debates, live features and technical platforms, confidently promoting itself as the ultimate UK electronics trade show.
Brandauer are taking the opportunity to network alongside other like-minded Engineers, Designers and Technicians who will be representing every aspect of the world of electrical and electronics manufacturing. A world and industry which according to a recent TBRC Briefing report, is expected to reach £2.3 trillion globally by 2020.
From product design, progression press tooling to prototyping and large-scale manufacture, over the past 20 or so years, Brandauer have become crucial partners to customers with critical connector and press-fit pin requirements.
During that time and during the development of bespoke press-fit requirements, Brandauer have come to know the truly important aspect of reliable connections when working with PCBs. Press-fit connectors, no matter how well designed and manufactured can cause mechanical stress on the PCB, with a ‘nozzle effect’ that leaves the PCB deformed over repeated use.
With that in mind, solder-free assembly becomes a number one priority for our customers and for our own peace of mind. The innovative and patented EloPin® press-fit connection ensures that the solder-free assembly we’re looking for, even in multi-contact applications can be realised. And the increased efficiency and robustness in interconnects only strengthens our relationship with our clients.
A huge part of the WNIE Live show is the co-located EMC UK 2018. Brandauer manufacture a comprehensive range of standard profile products to meet the widest variety of EMC Shielding applications and have been supplying to the market for over 20 years.
Whether it’s Enclosure Shielding, Connector Gaskets or Earthing Clips, Brandauer have the capability to produce bespoke shielding to exact specification, in a range of materials including hard stainless steel. Speed to market is significantly increased through the utilisation of standard tooling elements held as stock items.
There’s no better opportunity for the Electronics market and those looking for innovative metal component stamping solutions to get face-to-face with an experienced manufacturer. Brandauer will be on Stand H66 for those interested in attending.
Book a meeting at WNIE with one of our stamping, EloPin® and EMC experts by clicking HERE. Alternatively, call us direct on +44(0) 121 359 2822, send your specific EloPin® enquiry using the form on the product page or any general enquiries using the details here.
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